Sputtering target, method for forming amorphous oxide thin film using the same, and method for manufacturing thin film transistor
AssigneeIdemitsu Kosan Co., Ltd.
InventorsKoki Yano, Hirokazu Kawashima, Kazuyoshi Inoue
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Abstract
Disclosed is a sputtering target having a good appearance, which is free from white spots on the surface. The sputtering target is characterized by being composed of an oxide sintered body containing two or more kinds of homologous crystal structures.
Claims18
A sputtering target composed of an oxide sintered body containing two or more homologous crystal structures, wherein the homologous crystal structures include a first crystal phase and a second crystal phase, wherein the first crystal phase and the second crystal phase are selected from the group consisting of a InMO3(ZnO)m crystal structure wherein M is a tervalent metal element and m is from 0.5 to 10, a (YbFeO3)2FeO type crystal structure and mixture thereof, and wherein a maximum peak strength of X-ray diffraction for the first crystal phase P(1) and a maximum peak strength of X-ray diffraction for the second crystal phase P(2) meet a peak strength ratio of P(1)/P(2)=0.05˜20.
Dependencies are inferred from the claim text.