# US 8,450,816 B2 · Method for manufacturing a microelectromechanical component; and a microelectromechanical component

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- Number: US 8,450,816 B2
- Document ID: US8450816B2
- Status: Granted
- Kind: B2
- Application number: 13/357,088
- Filed: 2012-01-24
- Published: 2012-05-17
- Granted: 2013-05-28
- Earliest claimed: 2005-11-23
- Assignees: Murata Electronics Oy
- Applicants: Heikki Kuisma
- Inventors: Heikki Kuisma
- Web page: https://patentgrep.com/patent/US8450816B2

## CPC

- G01C 19/56: Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- B81B 7/02: containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence)
- B81C 1/0023: {Packaging together an electronic processing unit die and a micromechanical structure die (MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261)}
- G01C 19/5783: Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
- G01L 9/0042: {Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms (details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively)}
- G01P 1/023: {for acceleration measuring devices}
- G01P 15/0802: {Details}
- B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package
- B81B 2207/015: the micromechanical device and the control or processing electronics being integrated on the same substrate
- B81C 2203/0792: Forming interconnections between the electronic processing unit and the micromechanical structure
- H10W 72/07252: {changes in structures or sizes}
- H10W 72/227: {Multiple bumps having different sizes}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/722: {between stacked chips}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/752: {between stacked chips}
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- G01C: MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY (measuring liquid level G01F; radio navigation, determining distance or velocity by use of propagation effects, e.g. Doppler effects, propagation time, of radio waves, analogous arrangements using other waves G01S)
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)
- G01P: MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT (measuring or recording blood flow A61B5/02, A61B8/06; monitoring speed or deceleration of electrically-propelled vehicles B60L3/00; vehicle lighting systems adapted to indicate speed B60Q1/54; determining position or course in navigation, measuring ground distance in geodesy or surveying G01C; combined measuring devices for measuring two or more variables of movement G01C23/00; measuring velocity of sound G01H; measuring velocity of light G01J7/00; measuring direction or velocity of solid objects by reception or emission of radiowaves or other waves and based on propagation effects, e.g. Doppler effect, propagation time, direction of propagation, G01S; measuring speed of nuclear radiation G01T; measuring acceleration of gravity G01V; {measuring or recording the speed of trains B61L23/00; speed indicators incorporated in motor vehicles B60K35/00; measuring frequency or phase G01R; traffic control G08G})
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part, sealed by means of a cover part, and an electronic circuit part, suitably bonded to each other. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

## Claims

### Claim 1

A microelectromechanical component, whereby a microelectromechanical chip part is attached on top of an electronic circuit part, wherein the microelectromechanical chip part is sealed by a cover part, and wherein the cover part has lead-in structures for bringing electric connections through the cover part.

### Claim 2

A microelectromechanical component, whereby a microelectromechanical chip part is attached on top of an electronic circuit part, wherein the microelectromechanical chip part is sealed by a cover part, and wherein a dielectric layer is manufactured on a surface of the cover part.

### Claim 3 (depends on 2)

The microelectromechanical component according to claim 2 wherein there is a conductive redistribution layer manufactured after said dielectric layer.

### Claim 4 (depends on 3)

The microelectromechanical component according to claim 3 further comprising a protection layer made of a dielectric material on the conductive redistribution layer.

### Claim 5 (depends on 1)

The microelectromechanical component according to a claim 1 comprising bonding bumps on at least one spot of the surface of the electronic circuit part.

### Claim 6 (depends on 1)

The microelectromechanical component according to a claim 1 comprising bonding bumps on at least one spot of the surface of the cover part.

### Claim 7 (depends on 1)

The microelectromechanical component according to a claim 1 comprising bonding bumps on at least one spot of the surface of the cover part, wherein the microelectromechanical chip part is bonded to the electronic circuit part, by means of the flip-chip method.

### Claim 8 (depends on 7)

The microelectromechanical component according to a claim 7 wherein said bonding is made so that the surface of the electronic circuit part is bonded to the cover part facing the surface of the electronic circuit part.

### Claim 9 (depends on 8)

The microelectromechanical component according to a claim 8, wherein the bonding bumps of the microelectromechanical component form a conductive connection between the microelectromechanical chip part and the electronic circuit part.

### Claim 10 (depends on 9)

The microelectromechanical component according to a claim 9, comprising a narrow gap between the electronic circuit part and the cover part of the microelectromechanical chip part.

### Claim 11 (depends on 10)

The microelectromechanical component according to a claim 10, wherein said gap is filled with an underfill.

### Claim 12

A microelectromechanical component, whereby the microelectromechanical chip part is attached on top of the electronic circuit part so that the chip part is bonded to the surface of the electronic circuit part by means of the flip-chip method, wherein the microelectromechanical chip part is smaller than the electronic circuit part, wherein the microelectromechanical chip part is sealed by a cover part, and wherein the cover part has lead-in structures for bringing electric connections through the cover part.

### Claim 13 (depends on 12)

A microelectromechanical component according to claim 12, wherein the contact areas remain on the surface of the electronic circuit part for external connections of the microelectromechanical component.

### Claim 14 (depends on 1)

A microelectromechanical component according to claim 1, whereby the microelectromechanical chip part is attached on top of the electronic circuit part so that the chip part is bonded to the surface of the electronic circuit part by means of the flip-chip method.

### Claim 15 (depends on 14)

The microelectromechanical component according to a claim 14, comprising a narrow gap between the electronic circuit part and a cover part of the microelectromechanical chip part.

### Claim 16 (depends on 15)

The microelectromechanical component according to a claim 15, wherein said gap is filled with an underfill.

### Claim 17 (depends on 14)

The microelectromechanical component according to a claim 14, wherein external connections, of the microelectromechanical component containing the microelectromechanical chip part and the electronic circuit part, are implemented by means of wire connections.

### Claim 18 (depends on 14)

The microelectromechanical component according to a claim 14, wherein external connections, of the microelectromechanical component containing the microelectromechanical chip part and the electronic circuit part, are implemented by means of at least one of the following: bump connectors, conducting adhesive joints, or a direct soldering solution.

### Claim 19 (depends on 1)

A microelectromechanical acceleration sensor comprising a microelectromechanical component according to according to claim 1.

### Claim 20 (depends on 1)

A microelectromechanical sensor of angular acceleration comprising a microelectromechanical component according to according to claim 1.

### Claim 21 (depends on 1)

A microelectromechanical angular velocity sensor comprising a microelectromechanical component according to according to claim 1.

### Claim 22 (depends on 1)

A microelectromechanical stabilizer of frequency of oscillator comprising a microelectromechanical component according to according to claim 1.

### Claim 23 (depends on 1)

A microelectromechanical filter of an electrical signal comprising a microelectromechanical component according to according to claim 1.

### Claim 24 (depends on 1)

A microelectromechanical switching component for an electrical signal comprising a microelectromechanical component according to according to claim 1.

### Claim 25 (depends on 1)

A microelectromechanical impedance matching device comprising a microelectromechanical component according to according to claim 1.