Molding method using shape memory polymer

Abstract

A method is provided for molding a composite part defined by using a preform comprising a shape memory polymer (SMP) binder. A bound preform comprising the SMP binder in a permanent shape and defined by a simplified geometry provided to a mold. The bound preform is heated above a transformation temperature of the SMP binder and deformed into a shaped preform defined by the temporary shape of the SMP binder. In a molding sequence, the shaped preform is constrained in its temporary shape by the mold while resin is introduced to the mold and cured to produce a final part. The shape of the cured part defines the temporary shape of the SMP binder. The bound preform may be generally configured as a mat or be defined by a substantially flat surface such that the preform may be used as a preform to mold a variety of differing part configurations.

Dependencies are inferred from the claim text.