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US 8,440,044 B2Granted
Forming method for polymeric laminated wafers comprising different film materials
AssigneeInsight Equity A.P.X., L.P.
InventorHideyo Sugimura
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Abstract
A method of making a polymeric laminated wafer comprising different film materials that are softenable and formable at different softening temperatures corresponding with the film materials.
Claims20
A method for forming an optically functional laminated wafer comprising:
- (a) exposing an optically functional laminated wafer to a first temperature;
- (b) heating one side of the optically functional laminate wafer to a temperature higher than the first temperature;
- and
- (c) shaping the optically functional laminated wafer to a desired shape;
- wherein steps (a) through (c) are conducted substantially simultaneously of one another.
2 more elements
A method for forming an optical laminate wafer comprising:
- (a) heating an optical laminate wafer to a first temperature equal at least to a softening temperature of a first layer of the optical laminate wafer;
- (b) selectively directing an energy source at a second layer of the optical laminate wafer such that the second layer is heated to a temperature greater than the softening temperature of the first layer of the optical laminate;
- and
- (c) forming the optical laminate wafer into a desired shape;
- wherein steps (a) through (c) are conducted substantially coincident of one another.
2 more elements
Dependencies are inferred from the claim text.