Mold clamping device
AssigneeSumitomo Heavy Industries, Ltd.
InventorsTsutomu Miyatake, Norihito Okada, Shinji Terada
Life of this patent
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Abstract
A mold clamping device includes a first fixed member to which a stationary mold is to be attached; a first movable member to which a movable mold is to be attached; a second movable member configured to move together with the first movable member; a second fixed member provided between the first movable member and the second movable member; a mold clamping force generating mechanism configured to generate a mold clamping force due to an electromagnetic force between the second movable member and the second fixed member; and a mold clamping force amplifying mechanism configured to amplify the mold clamping force generated by the mold clamping force generating mechanism.
Claims5
A mold clamping device, comprising:
- a first fixed member to which a stationary mold is to be attached;
- a first movable member to which a movable mold is to be attached;
- a second movable member configured to move together with the first movable member;
- a second fixed member provided between the first movable member and the second movable member;
- a mold clamping force generating mechanism configured to generate a mold clamping force due to an electromagnetic force between the second movable member and the second fixed member;
- and
- a mold clamping force amplifying mechanism configured to amplify the mold clamping force generated by the mold clamping force generating mechanism.
Dependencies are inferred from the claim text.