# US 8,434,658 B2 · Joining method and reflow apparatus

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- Number: US 8,434,658 B2
- Document ID: US8434658B2
- Status: Granted
- Kind: B2
- Application number: 13/090,858
- Filed: 2011-04-20
- Published: 2011-08-11
- Granted: 2013-05-07
- Earliest claimed: 2009-01-08
- Assignees: Fujitsu Limited
- Applicants: Tetsuji Ishikawa
- Inventors: Tetsuji Ishikawa
- Web page: https://patentgrep.com/patent/US8434658B2

## CPC

- H05K 3/341: Surface mounted components
- H05K 3/3415: {on both sides of the substrate or combined with lead-in-hole components}
- H05K 2203/085: Using vacuum or low pressure
- H05K 2203/087: Using a reactive gas
- H05K 2203/1157: Using means for chemical reduction
- H05K 2203/1178: Means for venting or for letting gases escape
- H05K 2203/1527: Obliquely held PCB
- H05K 2203/1572: Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.

## Claims

### Claim 1

A joining method, comprising:
melting a hot melt joining material provided between a board and a component to be joined to the board in a first process vessel part;
mounting a second process vessel part on the first process vessel part in which the hot melt joining material is in a molten state between the board and the component to be joined to the board to form a process vessel; and
reducing a pressure of an ambient atmosphere of the hot melt joining material in the process vessel and tilting the board by tilting the process vessel while the hot melt joining material is in the molten state.

### Claim 2 (depends on 1)

The joining method as claimed in claim 1, wherein the board is tilted after the pressure of the ambient atmosphere of the hot melt joining material is reduced in said reducing and tilting.

### Claim 3 (depends on 1)

The joining method as claimed in claim 1, further comprising:
feeding a reducing gas around the hot melt joining material after reducing the pressure of the ambient atmosphere of the hot melt joining material.

### Claim 4 (depends on 3)

The joining method as claimed in claim 3, wherein the reducing gas is hydrogen gas.

### Claim 5 (depends on 1)

The joining method as claimed in claim 1, further comprising:
feeding a reducing gas around the hot melt joining material after reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board.

### Claim 6 (depends on 5)

The joining method as claimed in claim 5, wherein the reducing gas is hydrogen gas.

### Claim 7 (depends on 1)

The joining method as claimed in claim 1, wherein the hot melt joining material is heated from above the board using an infrared heater in said reducing and tilting.

### Claim 8 (depends on 1)

The joining method as claimed in claim 1, wherein the hot melt joining material is lead-free solder.

### Claim 9 (depends on 1)

The joining method as claimed in claim 1, further comprising:
holding and conveying the first process vessel part by a conveyance part,
wherein said mounting mounts the second process vessel part on the first process vessel part held and conveyed by the conveyance part.

### Claim 10 (depends on 1)

The joining method as claimed in claim 1, further comprising:
conveying the first process vessel part from a first chamber to a second chamber,
wherein said melting is performed in the first chamber, and
said mounting and said reducing are performed in the second chamber.