Via design apparatus and via design method based on impedance calculations
AssigneeFujitsu Limited
InventorsHirofumi Mori, Jun Yamada
Life of this patent
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Abstract
A via design apparatus includes a determination section that determines a value of a shape parameter indicating a shape of a via in a multilayer board. The via has a hole passing through the plurality of layers and a conductive section on a side wall of the hole. The apparatus also includes a calculation section that calculates a value of impedance of the via according to the value of the shape parameter.
Claims18
A via design apparatus for designing a via providing connections between a plurality of layers inside a multilayer board, the via design apparatus comprising:
- a determination section that determines a value of a shape parameter indicating a shape of a via in the multilayer board, the shape of the via having a hole passing through the plurality of layers and a conductive section on a side wall of the hole, the hole being a circular cylinder;
- and
- a calculation section that calculates a value of impedance of the via according to the value of the shape parameter which includes a radius of the circular cylinder and a central angle of the conductive section.
Non-transitory computer-readable recording medium storing a via design program that allows a computer to execute a process for calculating a value regarding a design of a via that provides connections between a plurality of layers inside a multilayer board, the process comprising:
- determining a value of a shape parameter indicating a shape of a via in the multilayer board, the shape of the via having a hole passing through the plurality of layers and a conductive section on a side wall of the hole, the hole being a circular cylinder;
- and
- calculating a value of impedance of the via according to the value of the shape parameter which includes a radius of the circular cylinder and a central angle of the conductive section.
A via design method for designing a via providing connections between a plurality of layers inside a multilayer board, the via design method comprising:
- determining, by using a computer, a value of a shape parameter indicating a shape of a via in the multilayer board, the shape of the via having a hole passing through the plurality of layers and a conductive section on a side wall of the hole, the hole being a circular cylinder;
- and
- calculating, by using the computer, a value of impedance of the via according to the value of the shape parameter which includes a radius of the circular cylinder and a central angle of the conductive section.
Dependencies are inferred from the claim text.