Predictive modeling of interconnect modules for advanced on-chip interconnect technology

A system for estimating performance of an interconnect structure of a semiconductor integrated circuit (IC), comprising:

• means for dynamically calculating electrical characteristics of the interconnect structure based on input data specific to multiple layers of the interconnect structure, the electrical characteristics of the interconnect structure comprising:
• an upper terminal capacitance component, a lower terminal capacitance component, a fringe capacitance component and a plate capacitance component, each capacitance component being between an interconnect element of the interconnect structure and a conductive plate of the interconnect structure;
• a charge sharing component associated with at least one other interconnect element of a same layer of an interconnect stack;
• and
• a field shielding component from the at least one other interconnect element of the same layer of the interconnect stack.

A method for dynamically calculating electrical characteristics of an interconnect structure based on input data specific to multiple layers of the interconnect structure, the method comprising:

• dynamically calculating, using a computer, an upper terminal capacitance component, a lower terminal capacitance component, a fringe capacitance component and a plate capacitance component, each capacitance component being between an interconnect element of the interconnect structure and a conductive plate of the interconnect structure;
• dynamically calculating, using a computer, a charge sharing component associated with at least one other interconnect element of a same layer of an interconnect stack;
• and
• dynamically calculating, using a computer, a field shielding component from the at least one other interconnect element of the same layer of the interconnect stack.