Micro grid computing system in tiered structure of bridge coupled processing hub with sensor and actuator docking bay

A method of forming a micro grid apparatus for use in a mainframe system or server system, said method comprising:

• forming a plurality of tiers,
• said tiers being distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction,
• each tier comprising a multiplicity of complex shapes interconnected by a plurality of bridge modules,
• said bridge modules including internal data buses for data transfer and electrical connection between the complex shapes and modules within the complex shapes;
• each complex shape of the multiplicity of complex shapes being a physical structure having an exterior boundary,
• each complex shape of the multiplicity of complex shapes comprising multiple docking bays such that each docking bay is configured to have a module latched therein,
• each complex shape of the multiplicity of complex shapes being either a power hub comprising a plurality of rechargeable batteries or a processor hub comprising plurality of processors, and
• a sensor module being latched in each sensor docking bay of at least one sensor docking bay and an actuator module being latched in each actuator docking bay of at least one actuator docking bay of each complex shape of one or more complex shapes of the multiplicity of complex shapes in one or more tiers of the plurality of tiers.