Method of determining solder paste height and device for determining solder paste height

A device for determining a solder paste height printed on a circuit board, the device comprising:

• an image obtaining unit configured to obtain a two-dimensional image of the circuit board which is captured from above a solder printed surface;
• and
• a height determining unit configured to determine the solder paste height corresponding to a pixel value of each of pixels of the two-dimensional image, based on height information which defines a relationship between the pixel value and the solder paste height, the pixel value being a value representing at least one of luminance of red in a RGB color model, luminance of green in the RGB color model, luminance of blue in the RGB color model, hue in a HSI color model, saturation in the HSI color model, and intensity in the HSI color model,
• wherein the height information shows that a difference between an intensity value and a hue value in the HSI color model corresponds to the solder paste height, and
• the height determining unit determines the solder paste height by calculating the difference.