MEMS microphone packaging and MEMS microphone module

A method for producing a microphone module, the method comprising:

• arranging a MEMS microphone structure on a first surface of a first substrate, the first substrate further comprising a second surface, which is opposite to the first surface;
• arranging a cap on the first surface of the first substrate such that the cap and the first surface enclose the MEMS microphone structure;
• arranging a cap structure on a first surface of a second substrate, the second substrate further comprising a second surface, which is opposite to the first surface;
• and
• attaching the second surface of the first substrate, which comprises the MEMS microphone structure on the first surface, to the second surface of the second substrate, which comprises the cap structure on the first surface.

A microphone module, comprising:

• a substrate structure comprising a first surface and a second surface, which is opposite to the first surface, the substrate structure comprising a first substrate comprising the first surface of the substrate structure as its first surface, the first substrate further comprising a second surface, which is opposite to the first surface of the first substrate, and a second substrate comprising the second surface of the substrate structure as its first surface, the second substrate further comprising a second surface, which is opposite to the first surface of the second substrate,
• a MEMS microphone structure arranged on the first surface;
• a cap arranged on the first surface such that the MEMS microphone structure is enclosed by the cap and the first surface;
• and
• a readout device for the MEMS microphone structure arranged on the second surface.

A microphone module, comprising:

• a first substrate having a first surface and a second surface, which is opposite to the first surface;
• a second substrate having a first surface and a second surface, which is opposite to the first surface, wherein the second surface of the first substrate is attached to the second surface of the second substrate;
• a MEMS microphone structure arranged at the first surface of the first substrate;
• a cap arranged at the first surface of the first substrate such that the cap and the first surface enclose the MEMS microphone structure;
• and
• a cap structure arranged at the first surface of the second substrate.

A method for producing a microphone module, the method comprising:

• providing a first substrate having a first surface and a second surface, which is opposite to the first surface, wherein a MEMS microphone structure and a cap are arranged on the first surface such that the MEMS microphone structure is enclosed by the cap and the first surface;
• providing a second substrate having a first surface and a second surface, which is opposite to the first surface, wherein a readout device for the MEMS microphone structure is arranged on the first surface of the second substrate;
• and
• attaching the second surface of the first substrate, which comprises the MEMS microphone structure on the first surface, to the second surface of the second substrate, which comprises the readout device on the first surface.