Power semiconductor module
AssigneeSemikkro Elektronik GmbH & Co., KG
InventorThomas Frank
Life of this patent
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Abstract
A power semiconductor module in which a substrate is provided with at least one power semiconductor and has first and second contact areas, wherein a first load connection element with first contact elements provided thereon is supported on the first contact areas and a second load connection element with second contact elements provided thereon is supported on the second contact areas. Wherein at least one spring element is provided for producing a pressure contact between the contact elements and the contact areas. To reduce the structural size of the module, the pressure contact between the contact elements and the contact areas is exerted by at least one electrical component arranged between the spring element and one of the load connection elements.
Claims13
A power semiconductor module comprising:
- a substrate provided with at least one power semiconductor therein, and including first and second contact areas;
- a first load connection element having first contact elements supported on said first contact areas;
- a second load connection element having second contact elements supported on said second contact areas;
- at least one spring for producing a pressure contact between said first and second contact elements and first and second said contact areas, respectively;
- and
- at least one electrical component disposed for applying pressure between said first and second contact elements and said first and second contact areas, said at least one electrical component being disposed between said spring and one of said load connection elements.
Dependencies are inferred from the claim text.