Cold plate assemblies and power electronics modules

A power electronics module comprising:

• a cold plate assembly comprising:
• a coolant fluid inlet;
• an inlet manifold layer comprising a coolant fluid outlet and an inlet channel, the inlet channel comprising a plurality of fluid inlet holes fluidly coupled to a plurality of impingement jet nozzles, wherein at least two fluid inlet holes of the plurality of fluid inlet holes are separated from the coolant fluid inlet by an unequal distance, and an inlet coolant fluid flow rate of a coolant fluid at each fluid inlet hole is substantially uniform;
• a target heat transfer layer comprising a plurality of target heat transfer cells, each target heat transfer cell comprising a plurality of target heat transfer layer fins that define a plurality of target heat transfer layer microchannels extending outwardly in a radial direction from a central impingement region;
• a second-pass heat transfer layer comprising a plurality of second-pass heat transfer cells, each second-pass heat transfer cell comprising a plurality of second-pass heat transfer layer fins that define a plurality of second-pass heat transfer layer microchannels extend inwardly in a radial direction toward a central fluid outlet region, and one or more transition channels positioned between each second-pass heat transfer cell, wherein:
• the second-pass heat transfer layer is thermally coupled to the target heat transfer layer;
• the transition channels fluidly couple the second-pass heat transfer layer to the target heat transfer layer;
• and
• the plurality of impingement jet nozzles is positioned through the central fluid outlet region of the second-pass heat transfer cells;
• and
• an outlet manifold layer comprising an outlet channel, the outlet channel comprising a plurality of fluid outlet holes, wherein:
• the outlet manifold layer is thermally coupled to the second-pass heat transfer layer and the inlet manifold layer;
• the outlet channel is fluidly coupled to the coolant fluid outlet;
• and
• the plurality of impingement jet nozzles passes through the plurality of fluid outlet holes;
• a substrate layer coupled to a backside of the target heat transfer layer;
• a power electronics device coupled to the substrate layer, wherein heat generated by the power electronics device is transferred to the coolant fluid within the cold plate assembly at least through the substrate layer and the target heat transfer layer.

A cold plate assembly comprising:

• an inlet manifold layer comprising a coolant fluid outlet and an inlet channel, the inlet channel comprising a plurality of fluid inlet holes fluidly coupled to a plurality of impingement jet nozzles, and a plurality of serpentine inlet channel walls;
• a target heat transfer layer comprising a plurality of target heat transfer cells, each target heat transfer cell comprising a plurality of target heat transfer layer fins having curved walls that define a plurality of target heat transfer layer microchannels extending outwardly in a radial direction from a central impingement region;
• a second-pass heat transfer layer comprising a plurality of second-pass heat transfer cells, each second-pass heat transfer cell comprising a plurality of second-pass heat transfer layer fins having curved walls that define a plurality of second-pass heat transfer layer microchannels extending inwardly in a radial direction toward a central fluid outlet region, and one or more transition channels positioned between each second-pass heat transfer cell, wherein:
• the second-pass heat transfer layer is thermally coupled to the target heat transfer layer;
• the transition channels fluidly couple the second-pass heat transfer layer to the target heat transfer layer;
• and
• the plurality of impingement jet nozzles is positioned through the central fluid outlet region of the second-pass heat transfer cells;
• and
• an outlet manifold layer comprising an outlet channel, the outlet channel comprising a plurality of fluid outlet holes and a plurality of serpentine outlet channel walls, wherein:
• the outlet manifold layer is thermally coupled to the second-pass heat transfer layer and the inlet manifold layer;
• the outlet channel is fluidly coupled to the coolant fluid outlet;
• the plurality of impingement jet nozzles passes through the plurality of fluid outlet holes;
• and
• a target heat transfer layer microchannel pattern that is defined by the plurality of target heat transfer layer microchannels is different from a second-pass heat transfer layer microchannel pattern that is defined by the plurality of second-pass heat transfer layer microchannels.