ESD clamp for multi-bonded pins

An electronic system comprising:

• a power consuming device;
• and
• a power source configured to provide power to the power consuming device;
• wherein at least one of the power consuming device or the power source includes a multi-bonded pin clamp, the multi-bonded pin clamp comprising:
• a plurality of input pins, each input pin electrically coupled to a single multi-bonded pin in the respective power consuming device or power source via a respective bond pad;
• and
• a plurality of clamp transistors, each clamp transistor coupled to a respective one of the input pins, wherein each of the plurality of clamp transistors is configured to prevent a voltage received at the respective bond pad from exceeding a respective voltage limit.

A method of designing a circuit having a multi-bonded pin clamp, the method comprising:

• coupling a multi-bonded pin to each of a plurality of bond pads;
• coupling each bond pad to a respective internal connection via a respective conductor;
• coupling each conductor to a respective one of a plurality of input pins of the multi-bonded pin clamp;
• and
• coupling each input pin to a respective one of a plurality of clamp transistors, each clamp transistor configured to prevent a voltage on the respective conductor from exceeding a respective voltage limit.