Image sensor module and camera module
AssigneeHon Hai Precision Industry Co., Ltd.
InventorWen-Chin Tsai
Life of this patent
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Abstract
An exemplary image sensor module includes a plate, an image sensor, and a number of conductive wires. The plate includes a top surface, a bottom surface, an light passing through hole, and a number of conductive pads on the top surface. The sensor includes a first surface and a number of bonding pads corresponding to the respective conductive pads. The first surface opposes the bottom surface. The first surface includes a light sensitive region aligned with the through hole, and a light insensitive region surrounding the light sensitive region. The insensitive region is mounted on the bottom surface. The bonding pads are arranged on the light insensitive region. The wires pass through the light passing through hole, and respectively electrically connect the bonding pads to the corresponding conductive pads.
Claims20
An image sensor module comprising:
- a plate, the plate comprising a top surface, a bottom surface facing away from the top surface, a light passing through hole extending through the top surface and the bottom surface, and a plurality of electrically conductive pads arranged on the top surface;
- an image sensor, the image sensor comprising a first surface and a plurality of bonding pads corresponding to the respective electrically conductive pads, the first surface opposing the bottom surface of the plate, the first surface comprising a light sensitive region aligned with the light passing through hole, and a light insensitive region surrounding the light sensitive region, the light insensitive region mounted on the bottom surface of the plate, the bonding pads arranged on the light insensitive region, and
- a plurality of conductive wires, the conductive wires passing through the light passing through hole, and respectively electrically connecting the bonding pads to the corresponding conductive pads, one end of each conductive wire being connected to the corresponding bonding pad on the light insensitive region, and the other end of each conductive wire being connected to the corresponding electrically conductive pad on the top surface.
A camera module comprising:
- a lens module having at least one lens, and
- an image sensor module connected with the lens module, the image sensor module comprising:
- a plate, the plate comprising a top surface, a bottom surface facing away from the top surface, a light passing through hole extending through the top surface and the bottom surface, and a plurality of electrically conductive pads arranged on the top surface;
- an image sensor, the image sensor comprising a first surface and a plurality of bonding pads corresponding to the respective electrically conductive pads, the first surface opposing the bottom surface of the plate, the first surface comprising a light sensitive region aligned with the light passing through hole, and a light insensitive region surrounding the light sensitive region, the light insensitive region mounted on the bottom surface of the plate, the bonding pads arranged on the light insensitive region, and
- a plurality of conductive wires, the conductive wires passing through the light passing through hole, and respectively electrically connecting the bonding pads to the corresponding conductive pads, one end of each conductive wire being connected to the corresponding bonding pad on the light insensitive region, and the other end of each conductive wire being connected to the corresponding electrically conductive pad on the top surface.
Dependencies are inferred from the claim text.