Touch panel and peripheral circuit thereof
AssigneeAu Optronics Corporation
InventorsKuo-Hua Lan, Fu-Ming Chang, Che-Cheng Kuo
Life of this patent
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Abstract
A touch panel and a peripheral circuit thereof are provided. Each bonding pad of the peripheral circuit includes a first conductive layer, a first protective layer, a second conductive layer, and a second protective layer sequentially arranged on a substrate from bottom to top. A covered area of the second conductive layer provided by the second protective layer is increased to cover a portion of the second conductive layer located above a junction area between the first protective layer and a terminal part of the first conductive layer, thereby increasing the reliability of the bonding pads.
Claims12
A peripheral circuit of a touch panel, the touch panel comprising a central sensing array area and a peripheral non-array area, the peripheral circuit comprising a plurality of bonding pads, each of the bonding pads comprising:
- a first conductive layer located on a substrate within the peripheral non-array area, the first conductive layer comprising a circuit part and a terminal part, wherein the circuit part is located near the central sensing array area, and the terminal part is located far away from the central sensing array area;
- a first protective layer covering the circuit part and exposing the terminal part;
- a second conductive layer located on the first protective layer and the terminal part, the second conductive layer comprising a bonding part located on the terminal part;
- and
- a second protective layer covering the second conductive layer and exposing a portion of the bonding part, wherein an outer edge of the second protective layer exceeds an outer edge of the first protective layer and further extends outwards a distance, thus covering the second conductive layer located above a junction area between the outer edge of the first protective layer and the terminal part.
A peripheral circuit of a display panel, the touch panel comprising a central array area and a peripheral non-array area, the peripheral circuit comprising a plurality of bonding pads, each of the bonding pads comprising:
- a first conductive layer located on a substrate within the peripheral non-array area, the first conductive layer comprising a circuit part and a terminal part, wherein the circuit part is located near the central array area, and the terminal part is located far away from the central array area;
- a first protective layer covering the circuit part and exposing the terminal part;
- a second conductive layer located on the first protective layer and the terminal part, the second conductive layer comprising a bonding part located on the terminal part;
- and
- a second protective layer covering the second conductive layer and exposing a portion of the bonding part, wherein an outer edge of the second protective layer exceeds an outer edge of the first protective layer and further extends outwards a distance, thus covering the second conductive layer located above a junction area between the outer edge of the first protective layer and the terminal part.
Dependencies are inferred from the claim text.