Test systems and methods for semiconductor devices
AssigneeInfineon Technologies AG
InventorWolfgang Marbler
Life of this patent
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Abstract
Test structures, systems, and methods for semiconductor devices are disclosed. In one embodiment, a test structure for a semiconductor device includes a winding disposed in at least one conductive material layer of the semiconductor device. At least a portion of the winding extends proximate a perimeter of the semiconductor device. The winding includes a first end and a second end. A first test pad is coupled to the first end of the winding, and a second test pad is coupled to the second end of the winding.
Claims24
A test system comprising:
- a semiconductor device comprising a first winding, at least a portion of the first winding extending proximate a perimeter of the semiconductor device, the semiconductor device further comprising a separate magnetic sensor;
- a magnetic field generator configured to produce a magnetic field, the magnetic field generator being different than the semiconductor device;
- an instrument adapted to measure an effect of the magnetic field on the semiconductor device, wherein the effect of the magnetic field is measurable across the first winding;
- and
- a probe card adapted to calibrate the magnetic sensor based on the measured magnetic field.
A method of testing a semiconductor device comprising:
- providing the semiconductor device comprising a magnetic sensor and a separate winding, at least a portion of the winding extending proximate a perimeter of the semiconductor device;
- providing a test device comprising a magnetic field generator;
- generating a magnetic field proximate the semiconductor device using the magnetic field generator of the test device;
- measuring an effect of the magnetic field on the winding of the semiconductor device;
- and
- calibrating the semiconductor device based on the measured magnetic field.
A method of fabricating a semiconductor device, the method comprising:
- forming a magnetic sensor in or on a semiconductor substrate;
- forming at least one conductive material layer on the semiconductor substrate;
- forming a test structure in the at least one conductive material layer, the test structure comprising a winding, at least a portion of the winding extending proximate a perimeter of the semiconductor device, the winding having a first end and a second end;
- coupling a first test pad to the first end of the winding;
- and
- coupling a second test pad to the second end of the winding.
A method of testing a wafer comprising:
- providing the wafer, the wafer comprises a test die and a separate device die, the test die comprising a winding and the device die not comprising the winding;
- providing a probe card comprising a magnetic field generator;
- generating a magnetic field proximate the wafer using the magnetic field generator;
- and
- measuring an effect of the magnetic field on the winding of the test die.
Dependencies are inferred from the claim text.