Probe wafer, probe device, and testing system

A probe device to be electrically connected to a semiconductor wafer having a plurality of semiconductor chips formed thereon, the probe device comprising:

• a first probe wafer that is to be electrically connected to the semiconductor wafer;
• and
• a second probe wafer that is electrically connected to the first probe wafer, wherein
• the first probe wafer includes:
• a first wafer substrate;
• a plurality of wafer connector terminals that are provided on the first wafer substrate in such a manner that one or more wafer connector terminals correspond to each of the semiconductor chips, each wafer connector terminal to be electrically connected to an input/output terminal of a corresponding semiconductor chip;
• a plurality of first intermediate connector terminals that are electrically connected to the plurality of wafer connector terminals;
• and
• a plurality of first circuit units that are provided in such a manner that one or more first circuit units correspond to each of the semiconductor chips, each first circuit unit outputting a signal in accordance with a signal received from the second probe wafer, and
• the second probe wafer includes:
• a second wafer substrate that opposes a surface of the first wafer substrate on which the plurality of first intermediate connector terminals are formed;
• a plurality of second intermediate connector terminals that are formed on the second wafer substrate in a one-to-one correspondence with the plurality of first intermediate connecter terminals, each second intermediate connector terminal being electrically connected to a corresponding one of the first intermediate connector terminals;
• and
• a plurality of second circuit units that are provided in such a manner that one or more second circuit units correspond to each of the first circuit units, each second circuit unit generating a signal to be supplied to a corresponding first circuit unit.

A probe wafer to be electrically connected to a semiconductor wafer having a plurality of semiconductor chips formed thereon, the probe wafer comprising:

• a wafer substrate;
• a plurality of wafer connector terminals that are provided on the wafer substrate in such a manner that one or more wafer connector terminals correspond to each of the semiconductor chips, each wafer connector terminal to be electrically connected to an input/output terminal of a corresponding semiconductor chip;
• a plurality of circuit units that are provided on the wafer substrate in such a manner that each of the circuit units corresponds to a predetermined number of semiconductor chips, each circuit unit generating signals to be supplied to a predetermined number of corresponding semiconductor chips;
• and
• one or more switches, each switch corresponding to one of the circuit units, that switches which one of the predetermined number of corresponding semiconductor chips is connected to the corresponding circuit unit, wherein
• each of the circuit units includes a plurality of test circuits,
• when a first test circuit from among the plurality of test circuits breaks down, one or more remaining test circuits from among the plurality of test circuits operates,
• each of the circuit units further includes a plurality of switching sections that select a test circuit to operate from among the plurality of test circuits, and
• when a first switching section from among the plurality of switching sections breaks down, one or more remaining switching sections from among the plurality of switching sections operates.