Surface acoustic wave device
AssigneeMurata Manufacturing Co., Ltd.
InventorsKenji Nishiyama, Takeshi Nakao, Michio Kadota
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Abstract
A surface acoustic wave device prevents a decrease in yield and a decrease in reliability, such as an impulse withstand voltage, and achieves good frequency characteristics, even when using higher frequencies. The surface acoustic wave device includes an IDT electrode disposed on a piezoelectric substrate, and a first insulating film and at least one second insulating film disposed on the IDT electrode, and utilizes a higher-order mode of an SH wave, in which the acoustic velocity of a surface acoustic wave in the first insulating film located closer to the IDT electrode than the insulating film at an outermost surface is higher than the acoustic velocity of a surface acoustic wave in the second insulating film located at the outermost surface.
Claims6
A surface acoustic wave device comprising:
- a piezoelectric substrate;
- an IDT electrode disposed on the piezoelectric substrate;
- a first insulating film disposed so as to cover an upper surface of the IDT electrode on the piezoelectric substrate;
- and
- at least one second insulating film disposed on the first insulating film;
- wherein
- the piezoelectric substrate, the IDT electrode, the first insulating film, and the at least one second insulating film are arranged and configured to utilize a higher-order mode of an SH wave;
- an acoustic velocity of a surface acoustic wave in at least one insulating film located closer to the IDT electrode than an insulating film located at an outermost surface among the at least one second insulating film is higher than the acoustic velocity of a surface acoustic wave propagating in the insulating film located at the outermost surface among the at least one second insulating film;
- and
- the insulating film located at the outermost surface is made of silicon oxide, the thickness thereof is about 45% to about 85% of a wavelength of the surface acoustic wave, the insulating film or films other than the insulating film located at the outermost surface are made of at least one insulating material selected from the group consisting of silicon nitride, aluminum oxide, and silicon carbide, and the thickness thereof is about 5% to about 21% of the wavelength of the surface acoustic wave.
A surface acoustic wave device comprising:
- a piezoelectric substrate;
- an IDT electrode disposed on the piezoelectric substrate;
- a first insulating film disposed so as to cover an upper surface of the IDT electrode on the piezoelectric substrate;
- and
- at least one second insulating film disposed on the first insulating film;
- wherein
- the piezoelectric substrate, the IDT electrode, the first insulating film, and the at least one second insulating film are arranged and configured to utilize a higher-order mode of an SH wave;
- an acoustic velocity of a surface acoustic wave in at least one insulating film located closer to the IDT electrode than an insulating film located at an outermost surface among the at least one second insulating film is higher than the acoustic velocity of a surface acoustic wave propagating in the insulating film located at the outermost surface among the at least one second insulating film;
- and
- the at least one second insulating film comprises one second insulating film, the second insulating film is made of silicon oxide, and the first insulating film is made of at least one insulating material selected from the group consisting of silicon nitride, aluminum oxide, and silicon carbide.
Dependencies are inferred from the claim text.