Substrate structure with compliant bump and manufacturing method thereof

A substrate structure with compliant bump comprising:

• a substrate having a surface,
• a trace layer formed on the surface, and
• a protective layer covering the trace layer, wherein the trace layer comprises a plurality of conductive pads, each of the conductive pads comprises an outer lateral wall and an upper surface, the protective layer comprises a plurality of openings, each of the openings reveals each of the conductive pads and comprises an inner lateral wall, wherein a first accommodating space is formed between the inner lateral wall and the outer lateral wall;
• a plurality of insulating bumps formed on the surface and located at the first accommodating space, wherein the plurality of insulating bumps and the protective layer are not one-piece and wherein each of the insulating bumps comprises a top surface, an inner surface, and an outer surface and defines a first body and a second body, wherein the first body is located on the surface and comprises a first width, the second body is located on top of the first body and protrudes from the protective layer, a second width is formed between the inner lateral wall and the outer lateral wall, and the second width is not smaller than the first width;
• and
• a metallic layer formed on the top surface, the inner surface of the insulating bump, and the upper surface of the conductive pad.