US 8,426,983 B2Granted

Semiconductor device

AssigneeElpida Memory, Inc.

InventorsHiromasa Takeda, Satoshi Isa, Mitsuaki Katagiri

Life of this patent

Estimating the term…

Loading patent…

Abstract

A semiconductor device may include: first and second wiring boards separated from each other via a gap; a semiconductor chip; first and second groups of electrode pads; and first and second groups of connection pads. The semiconductor chip is fixed to upper surfaces of the first and second wiring boards, and has a first portion adjacent to the gap. The first and second groups of electrode pads are disposed on the first portion. The first and second groups of electrode pads are aligned adjacent to side surfaces of the first and second wiring boards, respectively. The side surfaces of the first and second wiring boards face each other. The first and second groups of connection pads are disposed on lower surfaces of the first and second wiring boards, respectively. The first and second groups of connection pads are aligned adjacent to the side surfaces of the first and second wiring boards, respectively.

Claims22

Dependent claims

A semiconductor device comprising:

a first wiring board having a first surface, a second surface, and a side surface, the second surface opposing the first surface;
a second wiring board separated from the first wiring board via a gap, the second wiring board having a first surface, a second surface, and a side surface, the second surface opposing the first surface, and the side surface of the second wiring board facing the side surface of the first wiring board;
a semiconductor chip fixed to the first surface of the first wiring board and the first surface of the second wiring board, the semiconductor chip having a first portion adjacent to the gap;
a first group of electrode pads on the first portion, the first group of electrode pads being aligned adjacent to the side surface of the first wiring board;
a second group of electrode pads on the first portion, the second group of electrode pads being aligned adjacent to the side surface of the second wiring board;
a first group of connection pads on the second surface of the first wiring board, the first group of connection pads being aligned adjacent to the side surface of the first wiring board;
and
a second group of connection pads on the second surface of the second wiring board, the second group of connection pads being aligned adjacent to the side surface of the second wiring board,
wherein
the first group of electrode pads comprises a first electrode pad,
the first group of connection pads comprises first and second connection pads,
the first connection pad is electrically connected to the first electrode pad through a first wire that extends through the gap, without the second connection pad being directly connected to the first and second groups of electrode pads via a wire,
wherein the first connection pad is directly connected to the second connection pad through a second wire.

10 more elements

A semiconductor device comprising:

a first wiring board having a first surface, a second surface, and a side surface, the second surface opposing the first surface;
a second wiring board separated from the first wiring board via a gap, the second wiring board having a first surface, a second surface, and a side surface, the second surface opposing the first surface, and the side surface of the second wiring board facing the side surface of the first wiring board;
a semiconductor chip fixed to the first surface of the first wiring board and the first surface of the second wiring board, the semiconductor chip having a first portion adjacent to the gap;
a first group of electrode pads on the first portion, the first group of electrode pads being aligned adjacent to the side surface of the first wiring board;
a second group of electrode pads on the first portion, the second group of electrode pads being aligned adjacent to the side surface of the second wiring board;
a first group of connection pads on the second surface of the first wiring board, the first group of connection pads being aligned adjacent to the side surface of the first wiring board;
and
a second group of connection pads on the second surface of the second wiring board, the second group of connection pads being aligned adjacent to the side surface of the second wiring board,
wherein
the first group of electrode pads comprises a third electrode pad,
the first group of connection pads comprises a fifth connection pad electrically connected to the third electrode pad through a fifth wire that extends through the gap, and
the second group of connection pads comprises a sixth connection pad electrically connected to the fifth connection pad through a sixth wire that extends over the gap.

9 more elements

A semiconductor device comprising:

a wiring board having a center region that has a slit, the wiring board having first and second surfaces, the slit having a first side surface and a second side surface opposing the first side surface;
a semiconductor chip fixed to the first surface of the wiring board, the semiconductor chip having a first portion adjacent to the slit;
a first group of electrode pads on the first portion, the first group of electrode pads being aligned adjacent to the first side surface of the slit, and the first group of electrode pads comprising a first electrode pad;
a second group of electrode pads on the first portion, the second group of electrode pads being aligned adjacent to the second side surface of the slit;
a first group of connection pads on the second surface of the wiring board, the first group of connection pads being aligned adjacent to the first side surface of the slit, and the first group of connection pads comprising a first connection pad electrically connected to the first electrode pad through a first wire that extends through the slit;
and
a second group of connection pads on the second surface of the wiring board, the second group of connection pads being aligned adjacent to the second side surface of the slit, and the second group of connection pads comprising a second connection pad being electrically connected to the first connection pad through a second wire that extends over the slit.

4 more elements

A semiconductor device comprising:

a wiring board having a center region that has a slit, the wiring board having first and second surfaces, and the slit having a first side surface and a second side surface opposing the first side surface;
a semiconductor chip fixed to the first surface of the wiring board, the semiconductor chip having a first portion adjacent to the slit;
a first group of electrode pads on the first portion, the first group of electrode pads being aligned adjacent to the first side surface of the slit, and the first group of electrode pads comprising a first electrode pad;
a second group of electrode pads on the first portion, the second group of electrode pads being aligned adjacent to the second side surface of the slit;
a first group of connection pads on the second surface of the wiring board, the first group of connection pads being aligned adjacent to the first side surface of the slit, the first group of connection pads comprising first and second connection pads, the first connection pad being electrically connected to the first electrode pad through a first wire that extends through the slit, without the second connection pad being directly connected to the first and second group of electrode pads via a wire;
and
a second group of connection pads on the second surface of the wiring board, the second group of connection pads being aligned adjacent to the second side surface of the slit,
wherein the second connection pad is electrically connected to the first connection pad via a wiring.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/014,235Filed 26 Jan 2011
Priority: JP 2010-01692828 Jan 2010
Published: US 2011/0180934 A128 Jul 2011
Granted: 23 Apr 2013
Term ends: Not estimatedThe source records don’t support an estimate.

Classification27 codes

H10W 90/701
Package configurations: characterised by the relative positions of pads or connectors relative to package parts
H10P 72/74
For supporting or gripping: using temporarily an auxiliary support
H10W 70/68
Characterised by their insulating layers or insulating parts: shapes or dispositions thereof
H10W 72/00
Interconnections or connectors in packages