Semiconductor device including a first wiring having a bending portion and a via including the bending portion
AssigneePanasonic Corporation
InventorsMiwa Ichiryu, Hiroyuki Uehara, Hidetoshi Nishimura
Life of this patent
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Abstract
A first wiring (1) has a bending portion (2), a first wiring region (1a) extending from the bending portion (2) in the X direction, and a second wiring region (1b) extending from the bending portion (2) in the Y direction. A via (3) is formed under the wiring (1). The via (3) is formed so as not to overlap with a region of the bending portion (2) in the first wiring region (1a). The length of the via (3) in the X direction (x) is longer than the length thereof in the Y direction (y) and both ends of the via (3) in the Y direction overlap with both ends of the first wiring region (1a) in the Y direction.
Claims17
A semiconductor device comprising:
- a first wiring;
- a second wiring which is arranged under the first wiring;
- and
- a first via which is formed between the first wiring and the second wiring and electrically connects the first wiring and the second wiring, wherein:
- in a planar view, the first wiring comprises:
- a bending portion,
- a first wiring region extending from the bending portion in a first direction, and
- a second wiring region extending from the bending portion in a second direction orthogonal to the first direction,
- in a planar view, the first via is arranged so as to include the bending portion, and
- in a planar view, a length of the first via projecting from the bending portion in the first direction in the first wiring region is longer than a length of the first via projecting from the bending portion in the second direction in the second wiring region.
A semiconductor device comprising:
- a first wiring disposed in a first layer;
- a second wiring disposed in a second layer which is located under the first layer;
- and
- a via connecting the first wiring and the second wiring, wherein:
- the first wiring includes first and second regions arranged in directions orthogonal to each other, the first and second regions being connected at a bending portion,
- the via overlaps the bending portion and a portion of the first and second regions of the first wiring, and
- a first overlapping region in which the via overlaps the first region of the first wiring is greater than a second overlapping region in which the via overlaps the second region of the first wiring.
Dependencies are inferred from the claim text.