Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module

A manufacturing method of a semiconductor apparatus, comprising:

• forming a first insulation layer on a first main surface of a semiconductor substrate;
• forming a first conductive layer on the first insulation layer;
• forming a through hole from a second main surface of the semiconductor substrate opposite to the first main surface towards the first main surface to expose the first insulation layer;
• forming a second insulation layer on an inner wall of the through hole and on the second surface;
• removing a part of the first and second insulation layers to expose the first conductive layer in the through hole;
• forming a second conductive layer in the through hole and on the second insulation layer, the second conductive layer contacting the first conductive layer;
• and
• forming a filling member on the second conductive layer in the through hole, the filling member having a gap between a part of the filling member and a part of the second conductive layer on the first main surface side.