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US 8,426,974 B2Granted
Interconnect for an optoelectronic device
AssigneeSunPower Corporation
InventorsRyan Linderman, Keith Johnston, Thomas Phu, Matthew Dawson
Life of this patent
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Abstract
Interconnects for optoelectronic devices are described. An interconnect may include a stress relief feature. An interconnect may include an L-shaped feature.
Claims20
An interconnect for an optoelectronic device, the interconnect comprising:
- an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;
- a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends;
- and
- a stress relief feature formed in the interconnect body, the stress relief feature comprising a plurality of T-shaped slots, each T-shaped slot approximately aligned with a corresponding one of the plurality of bond pads, the vertical portion of each T-shaped slot proximate to the corresponding one of the plurality of bond pads, and the horizontal portion of each T-shaped slot distal from the corresponding one of the plurality of bond pads.
1 more element
An interconnect for an optoelectronic device, the interconnect comprising:
- an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;
- a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends;
- and
- a feature formed in the interconnect body, the feature comprising a first L-shaped extension at the first end of the interconnect body and a second L-shaped extension at the second end of the interconnect body, the horizontal bases of each of the first and second L-shaped extensions proximate to the inner surface and distal from the outer surface of the interconnect body.
1 more element
An interconnect for an optoelectronic device, the interconnect comprising:
- an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;
- a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends;
- a stress relief feature formed in the interconnect body, the stress relief feature comprising a plurality of T-shaped slots, each T-shaped slot approximately aligned with a corresponding one of the plurality of bond pads, the vertical portion of each T-shaped slot proximate to the corresponding one of the plurality of bond pads, and the horizontal portion of each T-shaped slot distal from the corresponding one of the plurality of bond pads;
- a first L-shaped extension at the first end of the interconnect body;
- and
- a second L-shaped extension at the second end of the interconnect body, the horizontal bases of each of the first and second L-shaped extensions proximate to the inner surface and distal from the outer surface of the interconnect body.
3 more elements
Dependencies are inferred from the claim text.