Back to results
US 8,426,970 B2Granted
Substrate processing including a masking layer
AssigneeIntermolecular, Inc.
InventorsZachary Fresco, Chi-I Lang, Sandra G. Malhotra, Tony P. Chiang, Thomas R. Boussie, Nitin Kumar, Jinhong Tong, Anh Duong
Life of this patent
Estimating the term…
Abstract
Methods for substrate processing are described. The methods include forming a material layer on a substrate. The methods include selecting constituents of a molecular masking layer (MML) to remove an effect of variations in the material layer as a result of substrate processing. The methods include normalizing the surface characteristics of the material layer by selectively depositing the MML on the material layer.
Claims10
A substrate comprising:
- a plurality of conductive regions including electrically conductive material;
- a plurality of dielectric regions interleaved with the conductive regions;
- and
- a masking layer formed along a surface of the dielectric region, such that the surface of the dielectric region is normalized, wherein the masking layer includes a plurality of constituents, and wherein at least one of the constituents is selected for compatibility with a subsequent process;
- wherein the plurality of constituents comprises:
- a head group selected from the group consisting of:
- a polyethylene oxide and an oligoethylene oxide, the head group configured for attachment with the substrate;
- a terminal group selected for providing control of the at least one characteristic;
- and
- a linking group for linking the head group with the terminal group.
7 more elements
Dependencies are inferred from the claim text.