US 8,426,968 B2 · High speed, high density, low power die interconnect system

Abstract

A system for interconnecting at least two die each die having a plurality of conducting layers and dielectric layers disposed upon a substrate which may include active and passive elements. In one embodiment there is at least one interconnect coupling at least one conducting layer on a side of one die to at least one conducting layer on a side of the other die. Another interconnect embodiment is a slug having conducting and dielectric layers disposed between two or more die to interconnect between the die. Other interconnect techniques include direct coupling such as rod, ball, dual balls, bar, cylinder, bump, slug, and carbon nanotube, as well as indirect coupling such as inductive coupling, capacitive coupling, and wireless communications. The die may have features to facilitate placement of the interconnects such as dogleg cuts, grooves, notches, enlarged contact pads, tapered side edges and stepped vias.

Claims20

Dependent claims

An interconnect system for coupling between die, the interconnect system comprising:

a first die including a plurality of first die conducting layers and a plurality of first die dielectric layers;
a second die including a plurality of second die conducting layers and a plurality of second die dielectric layers;
and
a slug disposed between the first die and the second die and coupling the first die to the second die, wherein:
the slug includes a slug conducting layer and a slug dielectric layer,
the slug conducting layer is coupled on a first end to at least one of the plurality of first die conducting layers on a side of the first die,
and a second end of the slug conducting layer is coupled to at least one of the plurality of second die conducting layers on a side of the second die.

4 more elements

Dependencies are inferred from the claim text.

High speed, high density, low power die interconnect system

Life of this patent

High speed, high density, low power die interconnect system

Life of this patent

Abstract

Claims20