Semiconductor package structure having plural packages in a stacked arrangement

A semiconductor package structure, comprising:

• a first package having at least one first semiconductor chip disposed on a first printed circuit board, at least one first connection and at least one first pad, where the at least one first connection and the at least one first pad are disposed at a same level on the at least one first semiconductor chip;
• and
• a second package having at least one first solder ball disposed on the first package, at least one second connection and at least one second pad, where the at least one second connection and the at least one second pad are disposed on the at least one first solder ball and arranged at a same level, and at least one second semiconductor chip is disposed on the at least one second connection and the at least one second pad, wherein
• the at least one first semiconductor chip is electrically connected to the first printed circuit board, the at least one first solder ball and the at least one second connection,
• the at least one second pad is electrically connected to the at least one second semiconductor chip, and the at least one first pad faces the at least one first solder ball, and
• the at least one first solder ball is in contact with the at least one first pad and the at least one second pad.

A semiconductor package structure, comprising:

• a first package having at least one first semiconductor chip disposed on a first printed circuit board, and at least one first pad disposed on the at least one first semiconductor chip;
• a second package having at least one second pad disposed on the first package, and at least one second semiconductor chip disposed on the at least one second pad;
• at least one first solder ball disposed between the first package and the second package;
• a second printed circuit board;
• and
• a third package, wherein
• the second printed circuit board and the third package are sequentially stacked on the second package,
• the first and second packages are electrically connected to each other through the at least one first pad and the at least one second pad, the at least first pad and the at least one second pad being in contact with the at least one first solder ball,
• the at least one second pad is electrically connected to the at least one second semiconductor chip to face the at least one first pad, and
• the second package is electrically connected to the third package through the second printed circuit board.