Multi-chip package having frame interposer

A multi-chip package, comprising:

• a frame interposer having a first surface and a second surface which face each other, the frame interposer having a first opening and a second opening;
• a first chip stack on the first surface and having n number of semiconductor chips, the first chip stack including a first semiconductor chip adjacent to the first surface, the first semiconductor chip extending over one of the first and second openings and exposing the other of the first and second openings;
• and
• a second chip stack on the second surface and having m number of semiconductor chips, the second chip stack including a second semiconductor chip adjacent to the second surface, the second semiconductor chip extending over the other of the first and second openings and exposing the one of the first and second openings,
• wherein n and m are positive integers, and
• wherein the frame interposer includes
• a plurality of frame leads, and
• a frame pad spaced apart from the plurality of frame leads, the frame pad including a first sub-pad, a second sub-pad, and a main pad between the first and second sub-pads, the first opening being between the main pad and the first sub-pad, and the second opening being between the main pad and the second sub-pad.