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US 8,426,930 B2Granted
Sensor module
AssigneeRobert Bosch GmbH
InventorsMartin Holzmann, Christian Ohl, Harald Emmerich
Life of this patent
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Abstract
A sensor module includes a housing and a chip system disposed therein, the chip system being disposed on a substrate and being embedded in a sealing layer deposited on the substrate. The chip system is disposed in a window region of a frame structure disposed on the substrate, the frame structure featuring substantially the same thermal expansion properties as the substrate.
Claims14
A sensor module comprising:
- a housing;
- and
- a chip system disposed in the housing, wherein the chip system is disposed on a first substrate and embedded in a sealing layer deposited on the first substrate, the chip system being disposed in a window region of a frame structure disposed on the first substrate, and wherein the frame structure has substantially the same thermal expansion properties as the first substrate and the frame structure is affixed to a second carrier substrate and extends from the first substrate to the second carrier substrate.
A panel comprising:
- a plurality of sensor modules, wherein each sensor module includes:
- a housing;
- and
- a chip system disposed in the housing, wherein the chip system is disposed on a substrate and embedded in a sealing layer deposited on the substrate, the chip system being disposed in a window region of a frame structure disposed on the substrate, and wherein the frame structure has substantially the same thermal expansion properties as the substrate;
- and
- a connection region;
- wherein the chip system of each sensor module is electrically connected to the connection region via (a) conductive patterns on the substrate, (b) corresponding bore holes in the frame structure of the respective sensor module, and (c) conductive patterns on at least one of an upper side of the panel and a lower side of the panel.
4 more elements
A sensor device, comprising:
- a carrier substrate;
- and
- a sensor module disposed on the carrier substrate, the sensor module including a housing and a chip system disposed in the housing, the chip system being disposed on a substrate of the housing and embedded in a sealing layer deposited on the substrate of the housing, wherein (i) the chip system is disposed in a window region of a frame structure disposed on the substrate, the frame structure and the substrate having substantially same thermal expansion properties, (ii)
- an upper side of the sensor module is mounted on the carrier substrate, and (iii) the chip system is disposed between the substrate of the housing and the carrier substrate.
1 more element
Dependencies are inferred from the claim text.