Semiconductor light emitting device and method for manufacturing same
AssigneeKabushiki Kaisha Toshiba
InventorsHidefumi Yasuda, Yuko Kato, Yasuharu Sugawara, Toshiyuki Terada, Kazuyoshi Furukawa
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Abstract
A semiconductor light emitting device includes: a support substrate; a metal layer provided on the support substrate; a semiconductor layer provided on the metal layer and including a light emitting layer; a contact layer containing a semiconductor, selectively provided between the semiconductor layer and the metal layer, and being in contact with the semiconductor layer and the metal layer; and an insulating film provided between the semiconductor layer and the metal layer at a position not overlapping the contact layer.
Claims4
A semiconductor light emitting device comprising:
- a semiconductor layer having a lower surface and including a light emitting layer;
- a contact layer selectively provided in contact with the lower surface;
- an insulating film provided in contact with the lower surface so as to surround the contact layer and be spaced apart from the side surfaces of the contact layer, the insulating film being thicker than the contact layer;
- a reflective material provided between the contact layer and the insulating film, the reflective material in contact with the sides of the insulating and the contact layer and in contact with the lower surface;
- and
- a metal layer provided below and covering the contact layer, the insulating film and the reflective material;
- and
- a support substrate provided below the metal layer, wherein the reflective material is made of a material having a higher reflectance with respect to the light emitted from the light emitting layer than the metal layer.
Dependencies are inferred from the claim text.