Method of forming a micro light emitting diode array
AssigneeLuxVue Technology Corporation
InventorsAndreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Abstract
A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
Claims30
A method of forming a micro LED array comprising:
- patterning a bonding layer on a carrier substrate to form a plurality of laterally separate locations of the bonding layer;
- transferring a p-n diode layer and a metallization layer to the carrier substrate after patterning the bonding layer;
- patterning the p-n diode layer to form a plurality of separate micro p-n diodes;
- forming a conformal dielectric barrier layer spanning sidewalls of the plurality of separate micro p-n diodes.
A method of forming a micro LED array comprising:
- transferring a p-n diode layer and a metallization layer to a carrier substrate, wherein transferring comprises bonding the metallization layer to a bonding layer on the carrier substrate;
- patterning the p-n diode layer to form a plurality of separate micro p-n diodes;
- patterning the metallization layer to form a respective plurality of separate locations of the metallization layer after transferring the p-n diode layer and the metallization layer to the carrier substrate and after patterning the p-n diode layer to form the plurality of separate micro p-n diodes;
- patterning the bonding layer on the carrier substrate to form a respective plurality of laterally separate locations of the bonding layer;
- and
- forming a conformal dielectric barrier layer spanning sidewalls of the plurality of separate micro p-n diodes.
A method of forming a micro LED array comprising:
- transferring a p-n diode layer and a metallization layer from a growth substrate to a plurality of pillars on a carrier substrate;
- patterning the p-n diode layer to form a plurality of separate micro p-n diodes;
- and
- forming a conformal dielectric barrier layer spanning sidewalls of the plurality of separate micro p-n diodes.
Dependencies are inferred from the claim text.