Laminated interconnects for organic opto-electronic device modules and method

A method of producing an encapsulated module of interconnected opto-electronic devices, comprising:

• forming a patterned first electrode layer on a substrate in a pattern to define an array of first electrodes;
• forming a layer of opto-electronically active material over said patterned first electrode layer on said substrate so as to overlie at least major portions of said first electrodes;
• forming over said layer of opto-electronically active material a patterned second electrode layer having an opposite polarity to the first electrode in a pattern to define an array of second electrodes corresponding to said first electrode array, wherein said first electrodes, second electrodes and opto-electronically active material between said first and second electrodes define an array of opto-electronically active cells on said substrate;
• wherein said layer of opto-electronically active material and said patterned second electrode layer are so formed as to overlie a major portion of each first electrode and such that a minor portion of each first electrode is exposed and not overlain by said patterned layer of opto-electronically active material and said second electrode layer;
• forming a patterned interconnect layer on an encapsulating sheet in a pattern to define an array of interconnect pads for interconnecting exposed first electrode portions on said substrate with second electrodes of adjacent cells;
• and
• laminating said patterned encapsulating sheet over said array of opto-electronically active cells so as to bring said interconnect pad array into contact with exposed first electrode portions and second electrodes of adjacent cells whereby said exposed first electrode portions are interconnected with said second electrodes of said adjacent cells by said interconnect pads and said interconnected cells are encapsulated by said encapsulating sheet to form an encapsulated module.