US 8,422,238 B2Granted

Signal conversion device

AssigneePhytrex Technology Corporation

InventorsFeng Chi Hsiao, Kun Shan Yang, Tung Fu Lin, Chin Fen Cheng, Chih Wei Lee

Life of this patent

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Abstract

The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface.

Claims16

Dependent claims

A signal conversion device comprising:

a substrate having a rear surface and a frontal surface, the rear surface being provided with a first contact region comprising at least a first contact and a second contact while the frontal surface being provided with a second contact region comprising at least a third contact and a fourth contact;
wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) technology, and wherein the IC is disposed at the rear surface or the frontal surface;
wherein the substrate is attached to a SIM card by means of adhesion, and the first and second contacts are configured to electrically contact to the SIM card;
and
wherein a dimension of the substrate is the same as that of the SIM card so that the substrate can be completely adhered to the SIM card.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/759,223Filed 13 Apr 2010
Priority: TW 98206043 U13 Apr 2009
Published: US 2010/0259904 A114 Oct 2010
Granted: 16 Apr 2013
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

G06K 19/0719
With integrated circuit chips: at least one of the integrated circuit chips comprising an arrangement for application selection, e.g. an…
G06K 19/07741
The record carrier consisting of two or more mechanically separable parts: comprising a first part operating as a regular record carrier and a…
G06K 19/07743
Constructional details, e.g. mounting of circuits in the carrier: external electrical contacts
H10W 74/114
The semiconductor body being completely enclosed: by a substrate and the encapsulations