Method for manufacturing circuit pattern-provided substrate

A method for manufacturing a circuit pattern-provided substrate, comprising:

• forming a resist layer on a substrate;
• forming an opening corresponding to a circuit pattern and having an eaves cross-sectional shape in the resist layer;
• forming a thin film layer having a portion formed on the substrate in the opening and a portion formed on the resist layer;
• and
• removing the resist layer such that the resist layer and the portion of the thin film layer formed on the resist layer are removed from the substrate,
• wherein the forming of the opening comprises exposing the resist layer with a mask device configured to change an exposure amount of the resist layer such that the eaves cross-sectional shape has a space at a boundary between the resist layer and the substrate, the opening and the thin film layer satisfy relationships of 0.06×T≦h≦0.67×(2c) and h/4<w≦(2c)/6, where h is a height of the space of the eaves cross-sectional shape, w is a width of the space of the eaves cross-sectional shape, T is a thickness of the portion of the thin film layer formed on the substrate, and 2c is a gap between adjacent openings, the opening is formed in a plurality in the forming of the opening, and the portion of the thin film layer formed on the substrate is formed in a plurality in the forming of the thin film layer.