Wiring board with built-in component and method for manufacturing wiring board with built-in component

A method for manufacturing a wiring board with a built-in component, comprising:

• preparing a core layer which includes
• an insulating board having an upper surface,
• a first wiring pattern provided on the upper surface of the insulating board
• an electrode provided on the upper surface of the insulating board, and
• a solder resist provided on the upper surface of the insulating board and surrounding the plurality of electrodes;
• providing an electronic component having a solder bump;
• placing the electronic component on the core layer such that the solder bump is placed on the electrode;
• forming a solder joining the electronic component to the electrode by melting and solidifying the solder bump;
• forming a sealing resin entirely covering the solder and the solder resist at a gap between the electronic component and the core layer;
• after said forming the sealing resin, roughening an upper surface of the first wiring pattern;
• providing a prepreg covering the electronic component and the roughened upper surface of the first wiring pattern;
• forming a layered structure by providing a metal foil on an upper surface of the prepreg;
• forming, by heating the layered structure, a component-fixing layer in which the prepreg fixes the core layer, the electronic component, and the metal foil;
• forming an interlayer wiring connecting the first wiring pattern to the metal foil;
• said forming the sealing resin comprises, before said placing the electronic component on the core layer, supplying resin material onto the upper surface of the insulating board, the electrode, and the solder resist, and
• said placing the electronic component on the core layer comprises placing the electronic component on the core layer such that the solder bump is placed on the electrode through the applied resin material.

A method for manufacturing a wiring board with a built-in component, comprising:

• Preparing a core layer which includes
• an insulating board having an upper surface,
• a first wiring pattern provided on the upper surface of the insulating board,
• an electrode provided on the upper surface of the insulating board, and
• a solder resist provided on the upper surface of the insulating board and surrounding the plurality of electrodes;
• providing an electronic component having a solder bump;
• placing the electronic component on the core layer such that the solder bump is placed on the electrode;
• forming a solder joining the electronic component to the electrode by melting and solidifying the solder bump;
• forming a sealing resin entirely covering the solder and the solder resist at a gap between the electronic component and the core layer;
• after said forming the sealing resin, roughening an upper surface of the first wiring pattern;
• providing a prepreg covering the electronic component and the roughened upper surface of the first wiring pattern;
• forming a layered structure by providing a metal foil on an upper surface of the prepreg;
• forming, by heating the layered structure, a component-fixing layer in which the prepreg fixes the core layer, the electronic component, and the metal foil;
• and
• forming an interlayer wiring connecting the first wiring pattern to the metal foil;
• before said placing the electronic component on the core layer, applying first resin material on the solder bump, wherein
• said placing the electronic component on the core layer comprises placing the electronic component on the core layer such that the solder bump is placed on the electrode through the coated resin material.