Method of manufacturing an embedded printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKwang Soo Park, Myung Gun Chong, Dek Gin Yang, Dae Jung Byun
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Abstract
The present invention relates to an embedded printed circuit board and a manufacturing method thereof. The present invention provides an embedded printed circuit board including a substrate in which a cavity is formed in a predetermined portion and a wiring layer is formed in a portion without the cavity; a chip inserted into the cavity and including a plurality of pads; a filler filled between the chip and the cavity to fix the chip; and a connection layer formed between the wiring layer and the pads to connect the wiring layer and the pads to each other. Further, the present invention provides a manufacturing method of the embedded printed circuit board.
Claims7
A method of manufacturing an embedded printed circuit board, the method comprising:
- forming a cavity in a predetermined portion of a substrate with a wiring layer;
- attaching an adhesive sheet on one surface of the substrate;
- inserting a chip with a plurality of pads into the cavity to fix the inserted chip onto the adhesive sheet;
- filling a filler between the cavity and the chip;
- and
- forming a connection layer connected to the wiring layer and the pads only in an area between the wiring layer and one or more of the pads,
- wherein a top surface of the chip and a top surface of the filler are in a same horizontal plane, and
- wherein the connection layer is formed such that one part of the connection layer is on the top surface of the filler and another part of the connection layer is on the top surface of the chip.
Dependencies are inferred from the claim text.