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AssigneeSamsung Electronics Co., Ltd.
InventorsJun-sik Hwang, Yun-kwon Park, Il-jong Song, Byeoung-ju Ha
Estimating the term…
Provided is a method for fabricating a duplexer. The method includes fabricating an embedded PCB having an isolation part built therein and forming pads on certain areas of an upper side of the embedded PCB to connect with an external terminal. Further, a first filter and a second filter are separately fabricated, each having at least one film bulk acoustic resonator which is fabricated by depositing a lower electrode, a piezoelectric layer, and an upper electrode in this respective order. Thereafter, the first and second filters are bonded onto the pads formed on the embedded PCB. The entire surface of the embedded PCD is packaged at a predetermined distance from the first and second filters.
A duplexer fabrication method comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Networks using bulk acoustic wave devices: duplexers
Frequency-selective devices, e.g. filters: combining or separating two or more different frequencies
For duplexers: including bulk acoustic wave [BAW] devices
Incorporating printed electric components, e.g. printed resistors, capacitors or inductors: incorporating printed inductors
Term ended 23 Aug 2024 (estimated)
1. Field of the Invention
The present invention generally relates to a duplexer and a duplexer fabrication method, and more specifically, to a high-integrated duplexer fabricated using an embedded printed circuit board and a duplexer fabrication method thereof.
2. Description of the Related Art
The above aspects, and other features and advantages of the present invention will become more apparent after a reading of the following detailed description when taken in conjunction with the drawing figures, in which:
FIGS. 1A and 1B are cross-sectional views illustrating the structure of duplexers fabricated according to a conventional method;
FIG. 2 is a cross-sectional view illustrating the structure of a duplexer using an embedded printed circuit board (PCB) fabricated according to an embodiment of the present invention;
Hereinafter, the present invention will be illustrated in detail with reference to the annexed drawing figures.
FIG. 2 is a view showing the structure of a duplexer finally fabricated according to an exemplary embodiment of the present invention. Referring to FIG. 2, on an embedded PCB (printed circuit board) 200 having an isolation part 110 and pads 160a, 160b, a transmitter filter 120 and a receiver filter 130 are bonded using ball bumps 150a, 150b. A packaging substrate 140 is bonded to the embedded PCB 200 with a predetermined distance from an upper portion of the transmitter filter (hereinafter, “first filter”) 120 and the receiver filter (hereinafter, “second filter”) 130.
The embedded PCB 200 is a PCB having passive elements such as an inductor, a capacitor and a resistor therein. The PCB is fabricated in a manner that a layer such as a copper diaphragm is attached on a side of a phenolic resin insulating board or an epoxy resin insulating board and a required circuit is patterned by etching (removing except for the circuit on the board) along a wiring pattern of the circuit. The embedded PCB 200 is fabricated by depositing the several PCBs and building an inductor and a capacitor therein. In one embodiment, the embedded PCB 200 is fabricated in a structure having the built-in isolation part 110 between the PCBs.