Semiconductor device and peeling off method and method of manufacturing semiconductor device

A method of forming a semiconductor device comprising:

• forming a lamination containing an oxide layer in contact with a nitride layer provided over a substrate;
• forming a first insulating layer over the lamination;
• forming a second insulating layer over the first insulating layer;
• forming a peeled off layer over the second insulating layer, said peeled off layer comprising a thin film transistor and a light emitting element, the light emitting element comprising an anode and a cathode with a light emitting layer interposed between the anode and the cathode, the light emitting layer comprising an organic light emitting material;
• adhering the peeled off layer to a support;
• and
• peeling off the peeled off layer adhered to the support, the first insulating layer and the second, insulating layer from the substrate at an interface between the nitride layer and the oxide layer by physical means,
• wherein the nitride layer is provided between the oxide layer and the substrate.

A method of manufacturing a semiconductor device comprising:

• forming a nitride layer over a substrate;
• forming an oxide layer over said nitride layer;
• forming a first insulating layer over said oxide layer;
• forming a second insulating layer over the first insulating layer;
• forming an element comprising a light emitting element over the second insulating layer, the light emitting element comprising an anode and a cathode with a light emitting layer interposed between the anode and the cathode, the light emitting layer comprising an organic light emitting material;
• adhering the element to a support;
• peeling off the support with the element, the oxide layer, the first insulating layer and the second insulating layer at an interface between the nitride layer and the oxide layer from the substrate and the nitride layer by physical means;
• and
• adhering a transferring body to the oxide layer to sandwich the element between the support and the transferring body.