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US 8,415,033 B2Granted
Cutting tool
AssigneeKYOCERA Corporation
InventorMasahito Matsuzawa
Life of this patent
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Abstract
A cutting tool is disclosed. The cutting tool comprises a substrate and a coating layer on the substrate. The coating layer consists of nitride or carbonitride containing Ti and Al, and has a thickness of 3 to 9 μm on a flank face. A first intensity ratio I(400)/I(311) of the coating layer on an outer surface is larger than the first intensity ratio of the coating layer on the substrate side.
Claims10
A cutting tool, comprising:
- a substrate;
- and
- a coating layer on the substrate:
- consisting of nitride or carbonitride containing Ti and Al;
- and
- having a thickness of 3 to 9 μm on a flank face,
- wherein a first intensity ratio I(400)/I(311) of a diffraction intensity I(400) of a plane (400) to a diffraction intensity I(311) of a plane (311) measured by a thin film X-ray diffraction method using Cu—Kα rays of the coating layer on an outer surface is larger than the first intensity ratio of the coating layer on the substrate side.
4 more elements
Dependencies are inferred from the claim text.