Method of manufacturing a circuit board
AssigneeIntel Corporation
InventorsJames A. McCall, David Shykind
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a circuit board which may include the steps of forming a circuit board with horizontal and vertical fiberglass fibers, rotating the circuit board, and cutting the circuit board so that the horizontal and vertical fiberglass fibers form a non-right angle with a cut line of the circuit board. The circuit board may have a plurality of conductive traces located thereon which pass by areas of higher fiberglass-to-resin material and lower fiberglass-to-resin material to assist in reducing differential to common mode conversion between signals in the plurality of conducive traces.
Claims21
A circuit board comprising:
- a resin;
- first and second fiberglass fibers;
- and
- first and second signal line traces capable of transmitting electrical signals, wherein a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace, wherein the first and second fiberglass fibers form a non-right angle with a cut line of the circuit board, and wherein the first and second signal line traces are capable of transmitting electrical signals at one gigahertz and above.
A circuit board comprising:
- a resin;
- first and second fiberglass fibers;
- and
- first and second signal line traces capable of transmitting electrical signals,
- wherein the first and second fiberglass fibers diagonally cross near the first and second signal line traces, wherein a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace, wherein the first and second fiberglass fibers form a non-right angle with a cut line of the circuit board, and wherein the first and second signal line traces are capable of transmitting electrical signals at one gigahertz and above.
A circuit board comprising:
- a resin;
- first and second fiberglass fibers;
- and
- first and second signal line traces capable of transmitting electrical signals;
- wherein the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern, wherein a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace, wherein the first and second fiberglass fibers form a non-right angle with a cut line of the circuit board, and wherein the first and second signal line traces are capable of transmitting electrical signals at one gigahertz and above.
Dependencies are inferred from the claim text.