Predicting simultaneous switching output noise of an integrated circuit
AssigneeXilinx, Inc.
InventorMark A. Alexander
Life of this patent
Estimating the term…
Abstract
Predicting simultaneous switching output noise of an IC device is described. User input is obtained. The user input includes: an identification of an input/output bank of an integrated circuit die; an identification of a device package substrate to which the integrated circuit die is to be attached; and an identification of input/output interface to be used by the input/output bank. A noise factor and an impedance are selected responsive to the user input. The noise factor is multiplied with the impedance to provide a result. The result, which is output, is a prediction of the simultaneous switching output noise of the integrated circuit device.
Claims20
A method for predicting simultaneous switching output noise of an integrated circuit device, comprising:
- obtaining, by a computer, user input including:
- an identification of an input/output bank of an integrated circuit die;
- an identification of a device package substrate to which the integrated circuit die is to be attached;
- and
- an identification of input/output interface to be used by the input/output bank;
- selecting a noise factor and an impedance responsive to the user input;
- multiplying the noise factor with the impedance to provide a result;
- and
- outputting the result as a prediction of the simultaneous switching output noise of the integrated circuit device.
A method for predicting simultaneous switching output noise of an integrated circuit device, comprising:
- computing a plurality of impedance profiles as a function of frequency responsive to simulated stimulus provided to a system model,
- wherein the plurality impedance profiles are for a plurality of input/output banks of a plurality of integrated circuit devices that include the integrated circuit device;
- generating through measurement at least one excursion profile for at least one reference input/output bank of at least one reference die for at least one device package substrates type;
- identifying a resonant frequency from the at least one excursion profile;
- generating at least one base noise curve at the resonant frequency for at least one input/output interface using multiple quantities of aggressors;
- dividing the at least one base noise curve with impedance from an impedance profile of the plurality of impedance profiles for the at least one input/output reference bank for the at least one device package substrate type to provide noise factors;
- storing the noise factors according to the at least one input/output interface and the numbers of aggressors in a database;
- storing the plurality of impedance profiles in the database;
- and
- outputting a value for the predicted simultaneous switching output noise of the integrated circuit device by a prediction engine.
A non-transitory machine-readable medium having stored thereon information that, when executed by a general-purpose processor, cause performance of a method for predicting simultaneous switching output noise of an integrated circuit device, the method comprising:
- obtaining user input including:
- an identification of an input/output bank of an integrated circuit die;
- an identification of a device package substrate to which the integrated circuit die is to be coupled;
- an identification of input/output interface to be used by a plurality of input/output banks;
- and
- a quantity of aggressors;
- selecting a noise factor and an impedance responsive to the user input;
- multiplying the noise factor with the impedance to provide a result;
- and
- outputting the result as a prediction of the simultaneous switching output noise of the integrated circuit device.
Dependencies are inferred from the claim text.