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AssigneeSecond Sight Medical Products, Inc.
InventorsJerry Ok, Robert J. Greenberg, Neil Hamilton Talbot, James Singleton Little, Rongqing Dai, Jordan Matthew Neysmith, Kelly H. McClure
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The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.
An implantable device, comprising:
A method of making an implantable device comprising:
Dependencies are inferred from the claim text.