Sealing of an implantable medical device

An implantable medical device (IMD), comprising:

• a housing assembly containing electronics components, the housing assembly including a substrate region comprising a modified substrate region that includes a covered substrate region and a boundary region;
• an intermediate layer adhering to the substrate region along substantially the entire modified substrate region;
• and
• a protective layer adhering to at least the intermediate layer along the covered substrate region but not along the boundary region such that, at the boundary region, the protective layer is not adhered to the intermediate layer,
• wherein an increased adhesion exists between the protective layer and the intermediate layer relative to adhesion that would be present between the substrate region and the protective layer and wherein the boundary region improves resistance to delamination at an edge of the housing assembly.

An implantable medical device (IMD), comprising:

• a housing assembly containing electronics components, the housing assembly including a substrate region comprising a modified substrate region that includes a covered substrate region and a boundary region;
• an intermediate layer adhering to the substrate region along the modified substrate region;
• and
• a protective layer adhering to at least the intermediate layer such that the protective layer adheres to the intermediate layer along the covered substrate region but does not adhere to the intermediate layer along the boundary region,
• wherein a bond between the intermediate layer and the protective layer is a Ti—O—Si bond, and wherein the Ti—O—Si bond is more stable than a PT—O—Si bond
• and wherein the boundary region improves resistance to delamination at an edge of the housing assembly.