Optocoupler

An optocoupler comprising:

• a substrate;
• a plurality of conductive traces located on the substrate;
• an optical transmitter die, the optical transmitter die operable to emit light, the optical transmitter die configured to be powered from a first power supply through one of the plurality of conductive traces;
• an optical receiver die, the optical receiver die operable to receive light emitted by the optical transmitter die, the optical receiver die configured to be powered from a second power supply through one of the plurality of conductive traces;
• and
• a conductive pad located on the substrate, wherein one of the optical transmitter and receiver dies is attached directly to the conductive pad, the other one of the optical transmitter and receiver dies is attached to the conductive pad through three layers of materials comprising an isolation layer sandwiched between two securing layers.

An optocoupler comprising:

• a conductive pad;
• an optical transmitter die configured to emit light;
• an optical receiver die configured to receive light;
• and
• an encapsulant encapsulating the optical transmitter and receiver dies;
• wherein both the optical transmitter and receiver dies are attached to the conductive pad such that one of the optical transmitter and receiver dies is attached directly to the conductive pad, and the other one of the optical transmitter and receiver dies is attached to the conductive pad through three layers of materials comprising an isolation layer sandwiched between two securing layers;
• and
• wherein the conductive pad comprises an elevated portion configured to receive the optical transmitter die such that a portion of light emitted from the optical transmitter die is configured to be received directly by the optical receiver die located on the conductive pad outside the elevated portion.