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US 8,411,457 B2Granted
Semiconductor package substrate
AssigneeSTMicroelectronics S.r.l.
InventorsFederico Ziglioli, Giovanni Graziosi, Mario Cortese
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AssigneeSTMicroelectronics S.r.l.
InventorsFederico Ziglioli, Giovanni Graziosi, Mario Cortese
Estimating the term…
A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.
A semiconductor package substrate configured to support a damage-sensitive device having a base and at least one side, the semiconductor package substrate including a package substrate core having a first surface with a first conductive layer formed thereon, the first conductive layer including a first conductive support zone and including a plurality of routing lines for electrically interconnecting the damage-sensitive device to other electronic devices, the first conductive support zone including no routing lines and the first conductive support zone configured so that when the damage-sensitive device is attached to the semiconductor package substrate at least one side of the damage-sensitive device is positioned over the first conductive support zone and a substantial portion of the base of the damage-sensitive device is positioned over the first conductive support zone.
An electronic system, comprising:
The electronic system of 11 wherein the electronic system comprises one of a bar code scanner, optical displays, computer system, digital still camera, and digital video camera.
A semiconductor package substrate configured to support a damage-sensitive device having a base and at least one side, the semiconductor package substrate including a package substrate core having a first surface with a first conductive layer formed thereon, the first conductive layer including a first conductive support zone and including a plurality of routing lines for electrically interconnecting the damage-sensitive device to other electronic devices, the first conductive support zone including no routing lines and the first conductive support zone configured so that when the damage-sensitive device is attached to the semiconductor package substrate a substantial portion of the base of the damage-sensitive device is positioned over the first conductive support zone.
Dependencies are inferred from the claim text.