Electronic device package, module, and electronic device

An electronic device package comprising:

• an electronic device including a circuit face on which an external electrode is formed;
• at least one insertion substrate forming a housing part in which the electronic device is disposed;
• and
• a flexible substrate including a wiring pattern electronically connected to the electronic device, at least a part of the flexible substrate is bent along the at least one insertion substrate and/or the electronic device,
• wherein at least one of the insertion substrates is made of a conductive material and is electrically connected to a ground line or a power supply line in the wiring pattern,
• wherein the at least one insertion substrate and the wiring pattern are electrically connected to each other on both sides of the at least one insertion substrate,
• wherein said at least one insertion substrate includes a plurality of substrates disposed side-by-side, and
• wherein gaps formed between ends of the plurality of insertion substrates are not aligned on a straight line in plan view.