Thermal interface material application for integrated circuit cooling

An apparatus, comprising:

• an integrated circuit module;
• a printed circuit board, the integrated circuit module being mounted on a first surface of the printed circuit board, the printed circuit board having at least one thermal interface material application via formed therein in alignment with the integrated circuit module;
• and
• a heat transfer device, the heat transfer device being mounted on a second surface of the printed circuit board and being thermally coupled to the integrated circuit module, the second surface of the printed circuit board being opposite to the first surface of the printed circuit board;
• wherein the integrated circuit module is a cavity-down type integrated circuit package.

An antenna assembly, comprising:

• an antenna package;
• a printed circuit board, the antenna package being mounted on a first surface of the printed circuit board, the printed circuit board having at least one thermal interface material application via formed therein in alignment with the antenna package;
• and
• a heat transfer device, the heat transfer device being mounted on a second surface of the printed circuit board and being thermally coupled to the antenna package, the second surface of the printed circuit board being opposite to the first surface of the printed circuit board;
• wherein the antenna package comprises a radio frequency integrated circuit (RFIC) die and an embedded antenna array package, wherein the RFIC die is flip-chip mounted to the embedded antenna array package.

An antenna assembly, comprising:

• an antenna package;
• a printed circuit board, the antenna package being mounted on a first surface of the printed circuit board, the printed circuit board having at least one thermal interface material application via formed therein in alignment with the antenna package;
• and
• a heat transfer device, the heat transfer device being mounted on a second surface of the printed circuit board and being thermally coupled to the antenna package, the second surface of the printed circuit board being opposite to the first surface of the printed circuit board;
• wherein the antenna package comprises a surface mounting feature for mounting to the first surface of the printed circuit board.

An antenna assembly, comprising:

• an antenna package;
• a printed circuit board, the antenna package being mounted on a first surface of the printed circuit board, the printed circuit board having at least one thermal interface material application via formed therein in alignment with the antenna package;
• and
• a heat transfer device, the heat transfer device being mounted on a second surface of the printed circuit board and being thermally coupled to the antenna package, the second surface of the printed circuit board being opposite to the first surface of the printed circuit board;
• wherein the antenna package is a millimeter wave antenna package.

An antenna assembly, comprising:

• an antenna package;
• a printed circuit board, the antenna package being mounted on a first surface of the printed circuit board, the printed circuit board having at least one thermal interface material application via formed therein in alignment with the antenna package;
• and
• a heat transfer device, the heat transfer device being mounted on a second surface of the printed circuit board and being thermally coupled to the antenna package, the second surface of the printed circuit board being opposite to the first surface of the printed circuit board;
• wherein the antenna package is a cavity-down type integrated circuit package.