Slidingly-engaged heat-dissipating assembly for memory and memory device having the same

A slidingly-engaged heat-dissipating assembly for a memory, configured for heat dissipation of the memory, the heat-dissipating assembly including:

• a first heat-dissipating body adhered to one side of the memory, a bottom edge of the first heat-dissipating body having a first supporting piece bent toward the memory, the first supporting piece having a pair of first engaging pieces, each of the first engaging pieces comprising a first stopping section extending outwards from the first supporting piece and a first insertion section perpendicular to the first stopping section;
• and
• a second heat-dissipating body adhered to the other side of the memory to correspond to the first heat-dissipating body, a bottom edge of the second heat-dissipating body having a second supporting piece bent toward the memory, the second supporting piece having a pair of second engaging pieces, each of the second engaging pieces comprising a second stopping section extending outwards from the second supporting piece and a second insertion section perpendicular to the second stopping section, the second insertion section extending toward the first insertion section;
• wherein the first insertion section is slidingly disposed inside the second stopping section, the second insertion is slidingly disposed inside the first stopping section, the first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.