Electrohydrodynamic fluid accelerator with heat transfer surfaces operable as collector electrode

An apparatus, comprising:

• a thermal management assembly for introduction into an enclosure and use in cooling one or more devices therein, the thermal management assembly defining a flow path for conveyance of air between ventilated boundary portions of the enclosure;
• first and second portions of a convective heat transfer component placed at different positions along the flow path,
• wherein at least a substantial majority of heat transfer surfaces of the first portion of convective heat transfer component include leading surfaces proximate a corona electrode and electrically coupled between high-voltage terminals to, when energized, electrohydrodynamically motivate fluid flow over heat transfer surfaces of both the first and second portions of the convective heat transfer component,
• wherein at least a substantial majority of the heat transfer surfaces of the second portion of the convective heat transfer component do not contribute the electrohydrodynamically motivated fluid flow thereover, and
• wherein an inlet portion and an outlet portion of the ventilated boundary are formed in generally adjacent surfaces of the enclosure.

A method comprising:

• using a thermal management assembly to cool one or more devices within an enclosure, the thermal management assembly defining a flow path for conveyance of air between ventilated boundary portions of the enclosure and including first and second portions of a convective heat transfer component placed at different positions along the flow path;
• and
• establishing a corona discharge current between a corona electrode proximate to leading portions of at least a substantial majority of heat transfer surfaces of the first convective heat transfer portion and thereby motivating fluid flow over heat transfer surfaces of both the first and second portions of the convective heat transfer component,
• wherein at least a substantial majority of the heat transfer surfaces of the second portion of the convective heat transfer component do not contribute the electrohydrodynamically motivated fluid flow thereover.

An apparatus comprising:

• an enclosure;
• at least one heat source disposed within the enclosure;
• a thermal management assembly for use in cooling one or more devices within an enclosure, the thermal management assembly defining a flow path for conveyance of air between ventilated boundary portions of the enclosure;
• first and second portions of a convective heat transfer component placed at different positions along the flow path;
• and
• a heat transfer path from the heat source to the first and second convective heat transfer portions;
• wherein at least a substantial majority of heat transfer surfaces of the first portion of convective heat transfer component include leading surfaces proximate a corona electrode and electrically coupled between high-voltage terminals to, when energized, electrohydrodynamically motivate fluid flow over heat transfer surfaces of both the first and second portions of the convective heat transfer component, and
• wherein at least a substantial majority of the heat transfer surfaces of the second portion of the convective heat transfer component do not contribute the electrohydrodynamically motivated fluid flow thereover.