Surface mount electronic component and method for manufacturing the same
AssigneePanasonic Corporation
InventorsJunichi Kurita, Kenji Kuranuki, Yuji Konda, Yukihiro Shimasaki
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Abstract
A surface mount electronic component includes an element, an anode terminal, a cathode terminal, and an outer package body. The element has a configuration including an anode, and a cathode formed on a part of the surface of the anode via a dielectric substance. An anode terminal is electrically connected to the anode, and a cathode terminal is electrically connected to the cathode. The outer package body covers an element laminated body such that a part of the anode terminal and a part of the cathode terminal are exposed. The outer package body is made of a norbornene resin. Thus, an electronic component having high reliability can be achieved.
Claims14
A surface mount electronic component, comprising:
- an element including:
- an anode;
- a cathode formed on a part of a surface of the anode via a dielectric substance;
- an anode terminal electrically connected to the anode;
- a cathode terminal electrically connected to the cathode;
- and
- an outer package body covering the element such that a part of the anode terminal and a part of the cathode terminal are exposed;
- wherein the outer package body is made of a norbornene resin containing an amount of norbornene monomers, the amount being greater than 0 ppm by weight and less than or equal to 10000 ppm by weight.
A method for manufacturing a surface mount electronic component comprising an element including an anode and a cathode formed on a part of a surface of the anode via a dielectric substance, the method comprising:
- electrically connecting the anode to an anode terminal;
- electrically connecting the cathode to a cathode terminal;
- fixing the element between an upper mold and a lower mold;
- infusing a norbornene resin between the upper mold and the lower mold;
- polymerizing the norbornene resin at a temperature of 60° C. or more and 100° C. or less;
- and
- then post-curing the norbornene resin at 90° C. or more and 160° C. or less until the norbornene resin contains norbornene monomer in an amount greater than 0 ppm by weight and less than or equal to 10,000 ppm by weight.
A method for manufacturing a surface mount electronic component comprising an element including an anode and a cathode formed on a part of a surface of the anode via a dielectric substance, the method comprising:
- electrically connecting the anode to an anode terminal;
- electrically connecting the cathode to a cathode terminal;
- fixing the element between an upper mold and a lower mold;
- infusing a norbornene resin between the upper mold and the lower mold;
- polymerizing the norbornene resin at a constant temperature;
- carrying out post-curing at a polymerization temperature or higher and at a temperature increased from the polymerization temperature by 20° C. or less;
- and
- then carrying out post-curing at a temperature increased from the post-curing temperature by 20° C. or more and 70° C. or less until the norbornene resin contains norbornene monomer in an amount greater than 0 ppm by weight and less than or equal to 10,000 ppm by weight.
Dependencies are inferred from the claim text.